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datasheet product structure silicon monolithic integrated circuit this product has no designed protection against rad ioactive rays 1/26 tsz02201-0h1h0b101660-1- 2 ? 2016 rohm co., ltd. all rights reserved. 5.jul.2016 rev.002 www.ro hm.com tsz22111 ? 14 ? 001 dc brushless fan motor driver multifunction single-phase full-wave fan motor driver BD61250MUV general description BD61250MUV is predriver ic to drive single phase h bridge output composed of external mos fet. the power supply input terminal and the drive outpu t have voltage rating of 40v, so it can be used in a 24v power supply without using voltage drop down circuit. features pre driver for external power mos fet speed controllable by pwm / dc voltage minimum output duty limit input / output duty slope adjustment silent drive by the pwm soft switching lead angle setting soft start standby mode current limit lock protection and automatic restart rotation speed pulse signal(fg), lock alarm signal(al) selectable drive pwm frequency selectable (50khz/25khz) application general consumer equipment of desktop pc, server, etc. office equipment, copier, fax, laser printer, etc. package w (typ) x d (typ) x h (max) vqfn024v4040 4.00mm x 4.00mm x 1.00mm absolute maximum ratings parameter symbol rating unit supply voltage v cc 40 v power dissipation pd 0.83 (note 1) w operating temperature topr 40 to +105 c storage temperature tstr 55 to +150 c junction temperature tjmax +150 c high side output voltage v oh v cc 7 to v cc v low side output voltage v ol 0 to 7 v output current i omax 10 ma signal output voltage v sig 40 v signal output current i sig 10 ma reference voltage (ref) output current i ref 10 ma input voltage1 (pwmin, cs, fsel, ssel, stben) v in1 5.3 v input voltage2 (hp, hm, adc input terminal) v in2 3.3 v (note 1) derate by 6.64mw/c when operating above t a=25c. (mounted on 114.3mm 76.2mm 1.57mm 1layer board) caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a shor t circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection mea sures, such as adding a fuse, in case the ic is ope rated over the absolute maximum ratings. vqfn024v4040
2/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 thermal resistance (note 1) parameter symbol thermal resistance (typ) unit 1s (note 3) 2s2p ( note 4) vqfn024v4040 junction to ambient ja 150.6 37.9 c/w junction to top characterization parameter (note 2) jt 20 9 c/w (note 1) based on jesd512a(stillair) (note 2) the thermal characterization parameter to report th e difference between junction temperature and the t emperature at the top center of the outside surface of the component package. (note 3) using a pcb board based on jesd513. layer number of measurement board material board size single fr4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and traces 70m (note 4) using a pcb board based on jesd517. layer number of measurement board material board size 4 layers fr4 114.3mm x 76.2mm x 1.6mmt top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70m 74.2mm x 74.2mm 35m 74. 2mm x 74.2mm 70m recommended operating conditions parameter symbol min typ max unit supply voltage v cc 4.5 12 36 v hall input voltage v h 0 2 v pwm input frequency f in 1 100 khz input-output truth table h; high, l; low, hiz; high impedance sig output is open drain output. input ic output motor drive output hp hm pwm a1h a1l a2h a2l fg out1 out2 h l h h h l l hiz l h l h h l l h h l h l h l l h h h l hiz l hiz l h l h l h h l hiz l
3/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 pin configuration block diagram pin description pin no. pin name function 1 gnd gnd 2 fsel drive pwm frequency select 3 ssel fg / al signal select 4 stben standby mode enable select 5 cs current sensing 6 n.c. 7 n.c. 8 a2l low side output 2 9 a2h high side output 2 10 a1l low side output 1 11 a1h high side output 1 12 vcc power supply 13 sig fg / al signal output 14 pwmin pwm signal input 15 ref reference voltage output 16 hp hall signal input + 17 hm hall signal input 18 adj output duty correction 19 la lead angle setting 20 lz recirculate angle setting 21 min minimum output duty setting 22 slp inputoutput duty slope setting 23 sst soft start time setting 24 ssw soft switching angle setting (top view) 2 1 3 4 adj hm hp 5 7 8 9 10 11 14 18 17 16 15 23 22 21 20 19 ref pwmin n.c. a2l a2h a1l a1h sst slp min la lz 6 sig vcc 12 13 24 ssw cs stben ssel fsel gnd n.c. a1l tsd control logic pre- drive - + comp ref hp hm a/d converter la lz sst ssw 5v i/o a1h a2h a2l + comp - cs sig pwmin vcc gnd min slp 5v i/o stben 5v i/o fsel osc adj 5v i/o ssel voltage regulator
4/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified ta=25c, v cc =12v) parameter symbol limit unit conditions characteristic min typ max data circuit current i cc 1 2.0 3.3 5 ma figure 1 standby current i cc 2 0.1 0.3 0.5 ma figure 2 hall input hysteresis v hys 5 10 15 mv figure 3 pwm input high level v pwmh 2 5.3 v pwm input low level v pwml 0.3 +0.8 v pwm input current i pwmh 10 0 +10 a v pwm =5v figure 4 i pwml 50 25 12 a v pwm =0v figure 5 pwm drive frequency 1 f pwm 1 35 50 65 khz fsel open pwm drive frequency 2 f pwm 2 17.5 25 32.5 khz fsel gnd short reference voltage v ref 2.7 3.0 3.3 v i ref =1ma figure 6, 7 current limit voltage v cl 140 160 180 mv figure 8 high side output high voltage v ohh vcc0.6 v cc 0.4 vcc0.1 v i o =3ma figure 9 high side output low voltage v ohl vcc5.2 v cc 4.9 vcc4.6 v i o =+3ma figure 10 low side output high voltage v olh 4.1 4.5 4.8 v i o =3ma figure 11 low side output low voltage v oll 0.1 0.2 v i o =+3ma figure 12 fsel input low level v fsell 0.3 0.8 v fsel=open: f pwm =50khz fsel=gnd: f pwm =25khz ssel input low level v ssell 0.3 0.8 v ssel=open:sig=fg ssel=gnd:sig=al stben input low level v stbl 0.3 0.8 v stben=open : standby function enable stben=gnd : standby function disable sig output low voltage v sigl 0.3 v i sig =+5ma figure 13 sig output leak current i sigl 10 a v sig =40v figure 14 lock protection on time t on 0.2 0.3 0.4 s figure 15 lock protection off time t off 4 6 8 s figure 16 about a current item, define the inflow current to ic as a positive notation.
5/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 typical performance curves (reference data) 30 20 10 0 10 20 30 0 10 20 30 40 supply voltage: v cc [v] hall input hysteresis: v hys [mv] 0 1 2 3 4 5 6 0 10 20 30 40 supply voltage: v cc [v] circuit current: i cc 1[ma] 10 5 0 5 10 15 20 0 10 20 30 40 supply voltage: v cc [v] pwm input current: i pwmh [a] figure 2. standby current vs supply voltage figure 1. circuit current vs supply voltage figure 4. pwm input current vs supply voltage (v pwm =5v) 10 5 c 25 c C 40 c 10 5 c 25 c C 40 c operating supply voltage range figure 3. hall input hysteresis vs supply voltage 0 1 2 3 4 5 6 0 10 20 30 40 supply voltage: v cc [v] standby current: i cc 2[ma] 10 5 c 25 c C 40 c 10 5 c 25 c C 40 c 10 5 c 25 c C 40 c operating supply voltage range operating supply voltage range operating supply voltage range
6/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 typical performance curves (reference data) C conti nued 2.4 2.6 2.8 3.0 3.2 3.4 0 2 4 6 8 10 source current: i ref [ma] reference voltage: v ref [v] 50 40 30 20 10 0 0 10 20 30 40 supply voltage: v cc [v] pwm input current: i pwml [a] 2.4 2.6 2.8 3.0 3.2 3.4 0 2 4 6 8 10 source current: i ref [ma] reference voltage: v ref [v] 100 120 140 160 180 200 0 10 20 30 40 supply voltage: v cc [v] current limit voltage: v cl [mv] figure 5. pwm input current vs supply voltage (v pwm =0v) figure 6. reference voltage vs source current (v cc =12v) figure 7. reference voltage vs source current ta=25c) 105 25 - 40 10 5 c 25 c C 40 c figure 8. current limit voltage vs supply voltage 10 5 c 25 c C 40 c v cc =24v v cc =12v v cc = 4.5v operating supply voltage range operating supply voltage range
7/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 typical performance curves (reference data) C conti nued 6 5 4 3 2 1 0 0 2 4 6 8 10 output source current: i o [a] high side output high voltage: v ohh [v] figure 9. high side output high voltage vs source c urrent (v cc =12v) figure 10. high side output low voltage vs sink cur rent (v cc =12v) figure 11. low side output high voltage vs source c urrent (v cc =12v) figure 12. low side output low voltage vs sink curr ent (v cc =12v) 6 5 4 3 2 1 0 0 2 4 6 8 10 output sink current: i o [a] high side output low voltage: v ohl [v] 0 1 2 3 4 5 6 0 2 4 6 8 10 output sink current: i o [a] output low side low voltage: v oll [v] 0 1 2 3 4 5 6 0 2 4 6 8 10 output source current: i o [v] output low side high voltage: v olh [v] 10 5 c 25 c C 40 c 10 5 c 25 c C 40 c 10 5 c 25 c C 40 c 10 5 c 25 c C 40 c
8/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 typical performance curves (reference data) C conti nued 0 1 2 3 4 5 0 10 20 30 40 sig voltage: v sig [v] sig output leak current: i sigl [a] 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 10 sig sink current: i sig [ma] sig output low voltage: v sigl [v] 2 4 6 8 10 0 10 20 30 40 supply voltage: v cc [v] lock protection off time: t off [s] figure 13. sig output low voltage vs sink current figure 14. sig output leak current vs sig voltage figure 15. lock protection on time vs supply voltag e 0.1 0.2 0.3 0.4 0.5 0 10 20 30 40 supply voltage: v cc [v] lock protection on time: t on [s] 10 5 c 25 c C 40 c 10 5 c 25 c C 40 c figure 16. lock protection off time vs supply volta ge 10 5 c 25 c C 40 c 10 5 c 25 c C 40 c opera ting supply voltage range operating supply voltage range
9/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 application circuit reference 1. direct pwm control this is the application example of direct pwm input into pwm terminal. minimum rotational speed is set in min terminal voltage. when a function is not used, do not let the a/d co nverter input terminal open. min ref ng terminal open (prohibited input) stben=h or open : standby mode enable stben=gnd : standby mode disable a1l m tsd control logic voltage regulator pre- drive - + comp ref hall hp hm a/d converter la lz sst ssw 5v i/o a1h a2h a2l a2h a2l + comp - cs sig pwmin vcc gnd min slp 5v i/o stben 5v i/o fsel osc pwm out1 out2 0.1f to 1f 500 to 2k 1f to 4.7f 10k to 100k 10k to 100k 1 0 k to 10 0 k 0 to 1 k 0 to 1 k adj 0 to 0. 5 5v i/o ssel min ref resistor divider ok soft ref resistor pull-down ok soft ref resistor pull-up ok
10/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 2. dc voltage control this is the application example of dc voltage into min terminal. minimum rotational speed setting is d isable. when a function is not used, do not let the a/d co nverter input terminal open. min ref ng terminal open (prohibited input) min ref resistor divider ok soft ref resistor pull-down ok soft ref resistor pull-up ok standby function does not work in dc voltage input application. please short the pwm and stben terminal to gnd. a1l m control logic voltage regulator pre- drive - + comp ref hall hp hm a/d converter la lz sst ssw 5v i/o a1h a2h a2l a2h a2l + comp - cs pwmin vcc gnd min slp 5v i/o stben 5v i/o fsel out1 out2 0.1f to 1f 500 to 2k 1f to 4.7f 1 0 k to 10 0 k 10k to 100k 10k to 100k 0 to 1 k 0 to 1 k adj 0 to 0. 5 dc 5v i/o ssel tsd sig osc
11/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 functional descriptions 1. speed control there are 2 ways to control the speed of motor. (1) pwm control (input pwm pulse into pwm terminal) (2) voltage control (input dc voltage into min term inal) the resolution of (1) input duty, (2) input voltag e are 8bit (256steps) both. output pwm resolution i s 8bit, output pwm frequency is 50khz (fsel=open) or 25khz (fsel=gnd). when computed duty is less than 2.3%, a driving si gnal is not output. (1) pwm control output pwm duty is changed depending on input pwm d uty from pwmin terminal, and rotational speed is controlled. please refer to input voltage 1(p.1) an d recommended operating conditions (p.2) for the si gnal input condition from a pwmin terminal. in the case of pwm in terminal is open, internal voltage (about 5v) is applied to pwmin terminal, and output is driven in 100%. becau se the pwm signal is filtered inside the ic and is signal processed, the pwm frequency of the drive output is not same to the input pwm frequency. minimum output duty setting (min) the voltage which divided ref terminal voltage by r esistance like figure 17 is input into min terminal , and minimum output duty is set. when input duty from a pwm terminal is lower than minimum output duty whic h is set by min terminal, the output duty does not fall to lower than minimum output duty. the min terminal is the input terminal of the analo gdigital converter to have an input voltage range of the ref voltage, and the resolution is 256 steps (0.39% per step). when minimum output duty is not set, please perform resistance pulldown of min terminal. out1 pwm (internal signal) out2 low high low high : high impedance motor output on low high low high a1h a1l low a2h high low a2l high ic output motor driving voltage figure 17. pwm input and minimum output duty setting min ref pwmin i/o refe- rence 5v pwm 200k(typ) figure 18. output pwm operation timing chart figure 20. relation of input and output duty when minimum duty is set 0 100 100 input pwm duty [%] output pwm duty [%] minimum duty min input voltage [v] output pwm duty [%] 0 v ref minimum output duty (256 steps) 100 0.75 25 figure 19. relation of min input voltage and output duty
12/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 (2) voltage control output duty is controlled by input voltage from min terminal. output duty is 100% when min terminal vo ltage is 3v (typ), output duty is 0% when min terminal volta ge is 0v. (if using slop function, it is not like t his.) in voltage control mode, short the pwmin terminal a nd stben terminal to gnd. standby function is disab led. *in voltage control mode, the voltage of min termin al is read with ad converter, and output duty is de cided. ad converter is off in standby mode, so ad converter c annot read the input voltage. please set the standb y function disable in voltage control. please refer to input voltage 2(p.1) for the input condition of the min terminal. because terminal vol tage becomes unsettled when min terminal is in an open state, li ke application of figure 21, please be applied some voltage to min terminal. minimum output duty cannot be set in voltage control. *in voltage control mode ? minimum output duty cannot be set ? standby function doesnt work 2. inputoutput duty slope setting (slp) slope properties of input duty and output duty can be set with slp terminal like figure 23. slp settin g work in both mode, pwm control and voltage control. the res olution is 7bit (128 steps). the voltage of slp terminal is less than 0.325v (ty p), slope of inputoutput duty characteristic is fi xed to 1. and fixed to 0.5 in 0.325v to 0.75v (typ) (refer to fig ure 24). when slope setting is not set, pulldown s lp terminal. figure 23. properties of inputoutput duty slope setting pwm input duty [%] 100 100 0 slope setting slope=2 slope=0.5 output duty [%] 0.75 0 ref 0.5 input-output duty slope (128 steps) 2 slp input voltage [v] slope of input-output duty 1 1.5 1.5 2.25 0.325 figure 24. relations of slp terminal voltage and th e inputoutput duty slope characteristics min pwmin i/o 5v dc 200k(typ) stben i/o 5v 200k(typ) v ref v min 3.3v 0% 100% 0.0v gnd motor motor motor motor torque torque torque torque output duty low : high impedance motor output motor output motor output motor output on high figure 21. voltage speed control application figure 22. operation of min terminal input
13/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 3. input and output duty properties adjustment func tion (adj) when input duty vs output duty shows the characteristic of the straigh t line, rotational speed may become the characteristics that middle duty area swells by the characteristic of fan motor. (figure 25) figure 25. properties curve of input pwm duty vs ro tational speed this ic reduces duty in the middle duty area and ca n adjust rotational speed characteristics of the mo tor with a straight line. figure 26. properties curve of input pwm duty vs ro tational speed after adjusting the adjustment to reduce duty is performed by adj t erminal input voltage. the adj terminal is input terminal o f a/d converter and the resolution is 8bit. by input 0 of the adj terminal, the characteristic of input duty vs. output duty becomes straight line (no adjustment). the adjustme nt become maximum by input 256(max), and output dut y in input duty 50% decreases to about 25%. figure 27. input duty vs output duty characteristic s please set the voltage of adj terminal so that moto r rotation speed in input duty 50% is on the diagon al which links the rotation speed of 0% to 100%. ic corrects output du ty so that overall rotation speed properties match a straight line. when it is used together with slp function, at firs t adj adjustment is performed in slope=1, and pleas e adjust slp after adjusting input duty vs. rotation speed property. output duty rotational speed output duty rotational speed
14/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 4. soft switching and regenerative angle setting (1) soft switching angle setting (ssw) angle of the soft switching can be set by the input voltage of ssw terminal. when one period of the ha ll signal is assumed 360, the angle of the soft switching can b e set from 0 to 90 by the input voltage of ssw te rminal (refer to figure 28). resolution of ssw terminal is 128 steps. operational image is shown in figure 29 . *soft switching angle means the section where outpu t duty changes between 0% and setting duty at the t iming of output phase change. to smooth off the current w aveform, the coefficient table that duty gradually changes is set inside ic, and the step is 16. (2) recirculate angle setting (lz) recirculate angle at the timing of output phase ch anges can be set by the input voltage of lz termina l. when one period of the hall signal is assumed 360, the angle of the recirculate can be set from 0 to 90 by the input voltage of lz terminal (refer to figure 30). resolu tion of lz terminal is 128steps. operational image is shown in figure 31. *recirculate angle means the section where the coi l current recirculate before the timing of output phase change. if it is set appropriately, it is effective to suppress leaping up of voltage by bemf, and red uce invalid electricity consumption. the logic of the output tr ansistor in the section is decided depending on the hall input logic. as for the output of the h logic, the logic of the motor output in high impedance (hiz). the o utput of the l logic remains l. figure 31. recirculate angle hp hm low high low high motor current v coil1 v coil2 angle range of soft switching 0 - max 90 hall signal 1cyle 360 soft switching angle (max 90) figure 29. soft switching angle 0.75 0 v ref 22.5 soft switching angle (128 steps) 90 ssw input voltage [v] 45 67.5 1.5 2.25 angle [] figure 28. relations of ssw terminal voltage and the angle of soft switching 0.75 0 v ref 22.5 lz re-circulate angle (128 steps) 90 lz input voltage [v] 45 67.5 1.5 2.25 angle [] figure 30. relations of lz terminal voltage and the angle of recirculate hp hm low high low high motor current v coil1 v coil2 angle range of re-circulate 0 - max 90 hall signal 1cycle 360 soft switching angle re-circulate angle (max 90)
15/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 5. lead angle setting (la) angle of lead/delay of the output phase change timi ng to the hall signal can be adjusted. when one per iod of the hall signal is assumed 360, lead/delay angle can be set from 0 to 22.5 by la terminal voltage (refer to figure 32). resolution of la terminal is 64steps (0.7 per step ). operational image is shown in figure 33. la setting decide the point of output changing timi ng, pwm soft switching and lz recirculate angle ar e decided based on that point. when pwm soft switching, recirculat e, lead angle setting are changed each, operational example image is show in figure 34. hp hm motor current out1 out2 soft switching angle 40 soft switching; 40 lead angle; - -- - 22.5 re-circulate angle; 0 hall signal 1cycle 360 lead angle 22.5 figure 34. motor operation waveform when each setting are applied hp hm motor current out1 out2 soft switching; 40 lead angle; - -- - 22.5 re-circulate angle; 20 hall signal 1cycle 360 lead angle 22.5 re-circulate angle 20 soft switching angle 20 0.75 0 v ref lead la lead/delay angle (64 steps) +22.5 la input voltage [v] 0 delay 22.5 1.5 2.25 angle [] figure 33. lead angle operation figure 32. relations of la terminal voltage and lead/delay angle
16/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 6. soft start soft start function gradually change drive duty to suppress sound noise and peak current when the moto r start up etc. pwm duty resolution is 8bit (256steps, 0.39% per st ep). sst terminal sets the step up time of duty inc rement. duty transition time is (difference of current duty and target duty (out put duty after slp/adj calculation)) x (step time) when soft start time is set for a long time, lock p rotection may be detected without enough motor torq ue when motor start up from 0% duty. therefore start up duty is s et to approximately 20% (50/256). when sst terminal voltage = ref terminal voltage, a nd 100% duty is input on motor stop condition, outp ut duty arrives at 100% after progress the time of 38.4ms x (256 50step) = 7.91 seconds soft start functions always work when the change of input duty as well as motor start up. in addition, it works when duty goes down from high duty. duty step down time is th e half of duty step up time. 7. start duty assist it is the function that enable the motor to start e ven if drive duty output is low, when the soft star t function is not used. when input duty is within 50% at motor stop conditi on, 50% duty is output till four times of hall sign al change are detected. operational image is shown in figure 37. start with input duty 50% s oft start step up time [ms ] 0.75 0 v ref 9.6 soft start step up time (256 steps) 38.4 sst input voltage [v] 19.2 28.8 1.5 2.25 20% pwm input drive pwm duty soft start section 100% 100% pwm input drive pwm duty soft start section 5 0% 2 0% 5 0% figure 35. relations of sst terminal voltage and so ft start step up time start with input duty 100% figure 36. soft start operation image from motor st op condition figure 37. start duty assist operation at input dut y 10% power on input duty 50% 0% fg 10% hall detect 50% output duty 10%
17/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 8. standby function (only for pwm control applicat ion) when pwmin terminal input duty is less than 1.5% (i nput pwm frequency 25khz), ic shut off the circuit to reduce current consumption in motor stop state. because ci rcuit current of ic oneself is cut with the standby mode, and the voltage output of the ref terminal stops, the power consumption that a hall device uses and the power consumption to use by resistance for the input setting of the a nalogdigital converter can be reduced. standby function is effective in stben = open, and can invalidate standby function in stben = gnd shor t. this ic processes input duty from pwmin terminal th rough the filter in logic circuit. therefore the ti me to shift standby mode varies according to input pwm duty before inpu tting pwm=l. when pwm=l is input, relations of the input duty till then and the time to detect 0% are shown in figure 39. figure 38. standby detection time and recover time figure 39. input pwm duty vs 0% detection time *when the soft start time is set, it takes more tim e to duty fall down except the filter time of figur e 39. standby state 0% detection time pwm standby signal (internal signal ) in operation pwm recognition time 1.2ms in operation
18/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 9. current limit current limit function turns off the output when th e current flow through the motor coil is detected e xceeding a set value. the working current value of the limit is determine d by current limit voltage v cl and cs terminal voltage. in figure 40, current flow in motor coil is io, res istor to detect io is rnf, power consumption of rnf is p r , current limit voltage v cl =150mv (typ), current limit value and power consump tion of rnf can be calculated below expression. when current limit function is not used, please sho rt cs terminal to gnd. 10. lock protection and automatic restart motor rotation is detected by hall signal period. i c detects motor rotation is stop when the period be comes longer than the time set up at the internal counter, and ic tur ns off the output. lock detection on time (t on ) and lock detection off time (t off ) are set by the digital counter based on internal oscillator. therefore the ratio of on/off time is a lways constant. timing chart is shown in figure 41. al signal is output in ssel terminal = gnd, and fg signal is output in ssel terminal = open. figure 41. lock protection timing chart current limit comp motor current gnd line r nf ic gnd line io m vcc gnd cs gnd + - figure 40. current limit setting and gnd line io[a] = v cl [v] / r nf [] = 150[mv] / 0.1[] = 1.5[a] p r [w] = v cl [v] x io[a] = 150[mv] x 1.5[a] = 0.225[w] t off out1 hp hm out2 fg t on lock lock detect lock release idring a1h a1l a2h a2l ic output motor output t on t on t off t off al
19/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 2v gnd hall input voltage range 11. highspeed detection protection when a hall input signal is abnormally fast (more t han 1.525khz, 45,750rpm as 4 pole motor), the lock protection operation works. when noise is easy to appear in a hall input signal, please put a capacitor between h all input terminals like c1 of figure 43. 10. hall input setting the input voltage of a hall signal is input in "hal l input voltage" in p.2 including signal amplitude. in order to detect rotation of a motor, the amplitude of hall signal m ore than "hall input hysteresis" is required. input the hall signal more than 30mvpp at least. figure 42. hall input voltage range reducing the noise of hall signal hall element may be affected by v cc noise or the like depending on the wiring pattern of board. in this case, place a capacitor like c1 in figure 43. in addition, when w iring from the hall element output to ic hall input is long, noise may be loaded on wiring. in this case, place a capacito r like c2 in figure 43. figure 43. application near of hall signal c2 hall element hm hp ref r1 rh c1 bias current v ref / (r1 + rh)
20/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 i/o equivalent circuit 1. hall signal input 2. pwm signal input drive pwm frequency select fg/al signal select standby mode enable select 3. current sensing 4. a/d converter input 5. reference voltage output 6. fg/al signal outp ut 7. high side output 8. low side output ref vcc sig pwmin fsel ssel stben inside reg inside reg 200k h p hm 1k adj la lz min slp sst ssw cs 1k a 1 h a2h vcc-5v vcc a 1 l a2l inside reg
21/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 i/o vcc gnd in normal energization internal circuit impedance is high amperage small circuit block i/o gnd reverse power connection large current flows thermal destruction circuit block vcc i/o gnd after reverse connection destruction prevention no destruction circuit block vcc sig driver protection resistor motor unit pullup resistor connector safety measure 1. reverse connection protection diode reverse connection of power results in ic destructi on as shown in figure 44. when reverse connection i s possible, reverse connection protection diode must be added b etween power supply and vcc. figure 44. flow of current when power is connected reversely 2. problem of gnd line pwm switching do not perform pwm switching of gnd line because gn d terminal potential cannot be kept to a minimum. figure 45. gnd line pwm switching prohibited 3. sig output sig is an open drain output and requires pullup re sistor. when sig pin is directly connected to power supply, over inflow current may damage the ic. by adding protect ion resister shown in figure 46, ic is protected fr om over current. figure 46. protection of sig terminal vcc motor driver gnd pwm input controller prohibited m
22/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 power dissipation 1. power dissipation power dissipation indicates the power that can be c onsumed by ic at ta=25c. ic is heated when it cons umes power, and the temperature of ic chip becomes higher than ambient temperature. the temperature that can be al lowed by ic chip into the package is the absolute maximum ratin g of the junction temperature. and it depends on ci rcuit configuration, manufacturing process, etc. power dissipation is de termined by this maximum junction temperature, ther mal resistance of mounting condition, and ambient temperature. the refore, when the power dissipation exceeds the abso lute maximum rating, the operating temperature range is not a gu arantee. the maximum junction temperature is in gen eral equal to the maximum value in the storage temperature range. 2. thermal resistance heat generated by consumed power of ic is radiated from the mold resin or lead frame of package. the p arameter which indicates this heat dissipation capability (h ardness of heat release) is called thermal resistan ce. thermal resistance from the chip junction to the ambient is represented in ja [c/w], and thermal characterization parameter from junction to the top center of the outside surf ace of the component package is represented in jt [c/w]. thermal resistance is divide into the package part and the substrate part. thermal resistance in the package p art depends on the composition materials such as the mold resins and t he lead frames. on the other hand, thermal resistan ce in the substrate part depends on the substrate heat dissip ation capability of the material, the size, and the copper foil area etc. therefore, thermal resistance can be decreased by t he heat radiation measures like installing a heat s ink etc. in the mounting substrate. the thermal resistance model is shown in figure 47, and equation is shown below. ja = (tj C ta) / p [oc/w] jt = (tj C tt) / p [oc/w] where: ja is the thermal resistance from junction to ambient [oc/w] jt is the thermal characterization parameter from junction to the top center of the outside surface o f the component package [oc/w] tj is the junction temperature [oc] ta is the ambient temperature [oc] tt is the package outside surface (top center) temperature [oc] p is the power consumption [w] even if it uses the same package, ja and jt are changed depending on the chip size, power cons umption, and the measurement environments of the ambient temperature , the mounting condition, and the wind velocity, et c. 3. thermal derating curve thermal derating curve indicates the power that ca n be consumed by the ic with reference to ambient t emperature. power that can be consumed by ic begins to attenuat e at ambient temperature 25c, and becomes 0w at th e maximum junction temperature 150c. the inclination is redu ced by the reciprocal of thermal resistance ja. th e thermal derating curve under a condition of thermal resistance (p.2) is shown in figure 48. 0.0 0.2 0.4 0.6 0.8 1.0 50 25 0 25 50 75 100 125 150 ambient temperature: ta[c] power dissipation: pd[w] figure 47. thermal resistance model of surface moun t figure 48. power dissipation vs ambient temperature 1/ ja = 6.64mw/c junction temperature: tj[c ] package outside surface (top center) temperature: tt[c] mounting substrate ambient temperature: ta[c] ja [c/w] jt [c/w] operating temperature range
23/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse po larity when connecting the power supply, such as mounting an ex ternal diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impeda nce supply lines. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of tempe rature and aging on the capacitance value when usin g electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient c ondition. however, pins that drive inductive loads (e.g. motor driver outputs, dcdc converter outputs) may inevitably go below ground due to back emf or electromotive force. in such cas es, the user should make sure that such voltages go ing below ground will not cause the ic and the system to malf unction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, oper ating frequency and pcb wiring to name a few. 4. ground wiring pattern when using both smallsignal and largecurrent grou nd traces, the two ground traces should be routed s eparately but connected to a single ground at the reference point of the application board to avoid fluctuations in the smallsignal ground caused by large currents. also ensure that t he ground traces of external components do not caus e variations on the ground voltage. the ground lines must be as sho rt and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperatu re rating be exceeded the rise in temperature of th e chip may result in deterioration of the properties of the ch ip. in case of exceeding this absolute maximum rati ng, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approxim ately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inr ush current may flow instantaneously due to the internal powering sequen ce and delays, especially if the ic has more than o ne power supply. therefore, give special consideration to power coup ling capacitance, power wiring, width of ground wir ing, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electr omagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connec ting a capacitor directly to a lowimpedance output pin may subject the ic to stress. always discharge capacitors compl etely after each process or step. the ics power su pply should always be turned off completely before connecting o r removing it from the test setup during the inspec tion process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage.
24/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 operational notes C continued 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. interpin shorts could be due to many reasons such as metal particles, water droplets (in very humid e nvironment) and unintentional solder bridge deposited in between pi ns during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high i mpedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transisto r and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected t o the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p subs trate layers between adjacent elements in order to keep them isolated. pn junctions are formed at the intersect ion of the p layers with the n layers of other elem ents, creating a parasitic diode or transistor. for example (refer t o figure below): when gnd > pin a and gnd > pin b, the pn junction operates as a parasitic diode. when gnd > pin b, the pn junction operates as a p arasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can re sult in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p subs trate) should be avoided. figure 49. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine a capacit ance value considering the change of capacitance wi th temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown (tsd) circuit this ic has a builtin thermal shutdown circuit tha t prevents heat damage to the ic. normal operation should always be within the ics maximum junction temperature rating . if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will acti vate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatic ally restored to normal operation. note that the tsd circuit operates in a situation t hat exceeds the absolute maximum ratings and theref ore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage.
25/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 ordering information b d 6 1 2 5 0 m u v e 2 part number package muv: vqfn024v4040 package and forming specification e2: embossed tape and reel marking diagram vqfn024v4040 (top view) 6 1 2 5 0 part number marking lot number 1pin mark
26/26 datasheet BD61250MUV ? 2016 rohm co., ltd. all rights reserved. www.rohm.co m tsz02201-0h1h0b101660-1-2 5.jul.2016 rev.002 tsz22111 ? 15 ? 001 physical dimension tape and reel information package name vqfn024v4040 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 ( ) direction of feed reel 1pin
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number BD61250MUV package vqfn024v4040 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes BD61250MUV - web page

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